TI's DualCool™ NexFET™ family of power MOSFETs delivers an industry standard footprint, while enabling thermally efficient cooling through the top and bottom of the package. This package allows power system designers to effectively direct heat away from the PCB in high-current DC/DC applications, resulting in improved power density, higher current capability and improved system reliability. Avnet is actively stocking TI MOSFET products with lead times from stock to 10 weeks.​